Power-Supply Bypassing

Power-supply bypassing improves noise margin and

prevents switching noise from propagating from the V+

supply to other components. A 0.1µF capacitor connect-

ed from V+ to GND is adequate for most applications.

Power-Supply Sequencing

and Overvoltage Protection

Caution: Do not exceed the absolute maximum rat-

ings because stresses beyond the listed ratings may

cause permanent damage to the device.

UCSP Package Considerations

For general UCSP package information and PC layout

considerations, please refer to the Maxim Application

Note (Wafer-Level Chip-Scale Package).

UCSP Reliability

The chip-scale package (UCSP) represents a unique

packaging form factor that may not perform equally to a

packaged product through traditional mechanical relia-

bility tests. UCSP reliability is integrally linked to the

user’s assembly methods, circuit board material, and

usage environment. The user should closely review

these areas when considering use of a UCSP package.

Performance through Operating Life Test and Moisture

Resistance remains uncompromised as it is primarily

determined by the wafer-fabrication process.

Mechanical stress performance is a greater considera-

tion for a UCSP package. UCSPs are attached through

direct solder contact to the user’s PC board, foregoing

the inherent stress relief of a packaged product lead

frame. Solder joint contact integrity must be consid-

ered. Information on Maxim’s qualification plan, test

data, and recommendations are detailed in the UCSP

application note, which can be found on Maxim’s web-

site at www.maxim-ic.com.

4.5

_______________________________________________________________________________________

9

Test Circuits/Timing Diagrams

50%

LOGIC

INPUT

COM_

GND

IN_

0V

NO_

OR NC_

SWITCH

OUTPUT

LOGIC

INPUT

LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES

THAT HAVE THE OPPOSITE LOGIC SENSE.

V+

V+

MAX4721/

MAX4722/

MAX4723

(

Figure 1. Switching Time

LOGIC

INPUT

GND

NO_

IN_

NC_

V+

V+

MAX4723

50%

0V

LOGIC

INPUT

SWITCH

OUTPUT 2

0V

SWITCH

OUTPUT 1

COM2

COM1

Figure 2. Break-Before-Make Interval