ZXT3M322

ISSUE 2 - JUNE 2002

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

83

°C/W

Junction to Ambient (b)

51

°C/W

Junction to Ambient (d)

125

°C/W

Junction to Ambient (e)

42

°C/W

THERMAL RESISTANCE

NOTES

(a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with all exposed pads attached.

(b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at t 5 secs with all exposed pads

attached.

(c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph.

(d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with minimal lead connections only.

(e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditions with all exposed pads attached.

(f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in the

package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight is

Rth=300°C/W giving a power rating of Ptot=420mW.

PARAMETER

SYMBOL

LIMIT

UNIT

Collector-Base Voltage

-50

V

Collector-Emitter Voltage

-40

V

Emitter-Base Voltage

-7.5

V

Peak Pulse Current

-4

A

Continuous Collector Current (a)

-3

A

Base Current

-1000

mA

Power Dissipation at TA=25°C (a)

Linear Derating Factor

1.5

12

W

mW/°C

Power Dissipation at TA=25°C (b)

Linear Derating Factor

2.45

19.6

W

mW/°C

Power Dissipation at TA=25°C (d)

Linear Derating Factor

1

8

W

mW/°C

Power Dissipation at TA=25°C (e)

Linear Derating Factor

3

24

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS.