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ZXT3M322TC Datasheet(PDF) 2 Page - Zetex Semiconductors |
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ZXT3M322TC Datasheet(HTML) 2 Page - Zetex Semiconductors |
2 / 6 page ZXT3M322 ISSUE 2 - JUNE 2002 2 PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) RθJA 83 °C/W Junction to Ambient (b) RθJA 51 °C/W Junction to Ambient (d) RθJA 125 °C/W Junction to Ambient (e) RθJA 42 °C/W THERMAL RESISTANCE NOTES (a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with all exposed pads attached. (b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at t 5 secs with all exposed pads attached. (c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph. (d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with minimal lead connections only. (e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditions with all exposed pads attached. (f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight is Rth=300°C/W giving a power rating of Ptot=420mW. PARAMETER SYMBOL LIMIT UNIT Collector-Base Voltage VCBO -50 V Collector-Emitter Voltage VCEO -40 V Emitter-Base Voltage VEBO -7.5 V Peak Pulse Current ICM -4 A Continuous Collector Current (a) IC -3 A Base Current IB -1000 mA Power Dissipation at TA=25°C (a) Linear Derating Factor PD 1.5 12 W mW/°C Power Dissipation at TA=25°C (b) Linear Derating Factor PD 2.45 19.6 W mW/°C Power Dissipation at TA=25°C (d) Linear Derating Factor PD 1 8 W mW/°C Power Dissipation at TA=25°C (e) Linear Derating Factor PD 3 24 W mW/°C Operating and Storage Temperature Range Tj:Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATINGS. |
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