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EQY-10-24-D Datasheet(PDF) 2 Page - Mini-Circuits

Part No. EQY-10-24-D
Description  Gain Equalizer Die
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Maker  MINI [Mini-Circuits]
Homepage  http://www.minicircuits.com
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Page 2 of 4
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Gain Equalizer Die
50Ω
10dB
DC to 20 GHz
Microwave
Pad Number
Function
Description
2
RF-IN
RF-Input pad
5
RF-OUT
RF-Output pad
1,3,4,6
GND
Ground
Product Features
• 10.0 dB Slope
• Wide Bandwidth, DC-20 GHz
• Excellent Return Loss, 20 dB typ.
General Description
EQY-10-24-D+ is an absorptive Gain Equalizer Die fabricated using highly repetitive GaAs IPD MMIC
process incorporating resistors, capacitors and inductors having negative insertion loss slope.
EQY-10-24-D+ has a nominal attenuation slope of 10.0 dB.
EQY-10-24-D+
Simplified Schematic and Pad description
Bonding Pad Position
Dimensions in µm, Typical
L1
L2
L3
L4
L5
H1
H2
H3
H4
Thickness Die Size
Bond Pad
#1, #3, #4, #6
Bond Pad
#2, #5
87
99
651
664
750
230
430
630
825
100
750x825
92 X 92
117 X 142
+RoHS Compliant
The +Suffix identifies RoHS Compliance. See our web site
for RoHS Compliance methodologies and qualifications
Ordering Information: Refer to Last Page
Typical Applications
• Fixed Satellite
• Mobile
• Radio location
• Space research
RF-IN
RF-OUT
REV. OR
M171290
EQY-10-24-D+
GY/RS/CP/AM
190123
Bonding Pad Position / Description
Die Dimensions in um
L1 L2
L3
L4
L5
H1 H2 H3
H4
87 99 651 664 750 230 430 630 825
Thickness
Die Size
Bond Pad #1, #3, #4, #6
Bond Pad #2, #5
100
750 x 825
92 x 92
117 x 142
Pad #
Description
1,3,4,6
Ground
2
Input
5
Output
L1
L3
L5
L4
H4
H3
H2
H1
0
L2
3
0
2
4
5
1
6




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