Data Sheet G16635EJ1V0DS

7

5. This device is very thin device and should be handled with caution for mechanical stress. The rate of distortion

applied to the device should become below 2000

characteristic of a device may be degraded and it may result in failure.

Figure 2. Direction of substrate and stress

The substrate that mounted the device is on a stand with a support width of 24 mm.

The device is turned downward. The stress is applied from a top.

Measurement position

Stress

Support width 24 mm

Substrate: 33 x 6 mm, t = 0.5 mm, FR-4

The direction of a device:

Device

Bend

Figure 3. Example of the bend and the rate of distortion

Note2

0

0

0.2

0.4

0.6

0.8

1

1000

2000

3000

4000

5000

6000

Bend - mm

Recommended condition

Note 1. Definition of rate of distortion(written as

ε in this document)

l: Distance above-mentioned when receiving stress.

2. The relation of the distortion and the bend changes with several conditions, such as a size of substrate and

so on.