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GBU4005_18 Datasheet(PDF) 1 Page - Guangzhou Juxing Electronic Co., Ltd.

Part No. GBU4005_18
Description  GBJ35005
Download  2 Pages
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Maker  JUXING [Guangzhou Juxing Electronic Co., Ltd.]
Homepage  http://www.trr-jx.com
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 1 page
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FEATURES
· Glass passivated chip junction
GBU
· Reliable low cost construction utilizing molded
plastic technique
· Ideal for printed circuit board
· Low forward voltage drop
· Low reverse leakage current
· High surge current capability
MECHANICAL DATA
Case: Molded plastic, GBU
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Mounting position: Any
Weight: 0.15ounce, 4.0gram
Maximum Ratings and Electrical Characteristics
Ratings at 25ambient temperature unless otherwise specified.
Single phase, half wave, 60HZ, resistive or inductive load.
For capacitive load, derate current by 20%.
Dimensions in millimeters
DimMin
Max
A
21.8
22.3
B
3.5
4.1
C
7.4
7.9
D
1.65
2.16
E
2.25
2.75
G
1.02
1.27
H
4.83
5.33
J
17.5
18.0
K
4.2 X 45°
L
18.3
18.8
M
3.30
3.56
N
0.46
0.56
P
0.76
1.0
- ~ ~ +
A
B
K
D
E
F
G
H
J
M
N
P
L
C
· UL Recognized File # E469616
BRIDGE RECTIFIERS
GBU4005 THRU GBU410
F
2.05
2.3
6.3
25.7
Average Rectified Output Current (Note 1)@T =90
(Note 2)
Typical Thermal Resistance per leg (Note 3)
Rating for fusing (t <8.3ms)
1.1
@IF=2A
Forward Voltage per element
@IF=4A
80
65
θJA
C
Typical Junction Capacitance per leg
RRM
Peak Reverse Current
@T =25
At Rated DC Blocking Voltage
@T =125
A
4.0
410
408
406
404
402
401
4005
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
1.0
GBU
GBU
GBU
SYMBOL
V
VRWM
VDC
VRMS
35
70
140
280
420
560
700
VFM
R
RθJL
TJ,TSTG
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
Operating and Storage Temperature Range
RMS Reverse Voltage
-55to+150
uA
pF
℃/W
IR
5.0
500
A
V
IFSM
UNITS
V
V
A
1000
100
200
400
600
800
50
TYPE NUMBER
GBU
GBU
GBU
GBU
Note:1. Mounted on glass epoxy PC board with 1.3mm
2 solder pad.
A
J
C
I
2
t
26
A s
2
3. Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink.
I
2
t
IF(AV)
http://www.trr-jx.com
version: 02




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