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GBU6005_18 Datasheet(PDF) 1 Page - Guangzhou Juxing Electronic Co., Ltd.

Part No. GBU6005_18
Description  BRIDGE RECTIFIERS
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Maker  JUXING [Guangzhou Juxing Electronic Co., Ltd.]
Homepage  http://www.trr-jx.com
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 1 page
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FEATURES
· Glass passivated chip junction
GBU
· Reliable low cost construction utilizing molded
plastic technique
· Ideal for printed circuit board
· Low forward voltage drop
· Low reverse leakage current
· High surge current capability
MECHANICAL DATA
Case: Molded plastic, GBU
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Mounting position: Any
Weight: 0.15ounce, 4.0gram
Maximum Ratings and Electrical Characteristics
Ratings at 25ambient temperature unless otherwise specified.
Single phase, half wave, 60HZ, resistive or inductive load.
For capacitive load, derate current by 20%.
Dimensions in millimeters
DimMin
Max
A
21.8
22.3
B
3.5
4.1
C
7.4
7.9
D
1.65
2.16
E
2.25
2.75
G
1.02
1.27
H
4.83
5.33
J
17.5
18.0
K
4.2 X 45°
L
18.3
18.8
M
3.30
3.56
N
0.46
0.56
P
0.76
1.0
- ~ ~ +
A
B
K
D
E
F
G
H
J
M
N
P
L
C
BRIDGE RECTIFIERS
GBU6005 THRU GBU610
F
2.05
2.3
· UL Recognized File # E469616
31
@IF=6A
@IF=3A
1.1
Forward Voltage per element
120
6005
6.0
610
608
606
604
602
601
7.6
65
1.0
GBU
GBU
GBU
SYMBOL
VRRM
VRWM
VDC
VRMS
35
70
140
280
420
560
700
VFM
RθJA
RθJL
TJ,TSTG
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
Operating and Storage Temperature Range
RMS Reverse Voltage
-55to+150
uA
Typical Junction Capacitance per leg
pF
℃/W
IR
5.0
500
A
V
IFSM
UNITS
V
V
A
1000
100
200
400
600
800
50
TYPE NUMBER
GBU
GBU
GBU
GBU
Peak Reverse Current
@T =25
At Rated DC Blocking Voltage
@T =125
A
A
CJ
Rating for fusing (t <8.3ms)
I
2
t
59.7
A s
2
I
2
t
Average Rectified Output Current (Note 1)@T =90℃
C
(Note 2)
Typical Thermal Resistance per leg (Note 3)
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
Note:1. Mounted on glass epoxy PC board with 1.3mm
2 solder pad.
3. Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink.
IF(AV)
http://www.trr-jx.com
version: 02




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