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GBU6005 Datasheet(PDF) 1 Page - Guangdong Juxing Electronics Technology Co., Ltd. |
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GBU6005 Datasheet(HTML) 1 Page - Guangdong Juxing Electronics Technology Co., Ltd. |
1 / 2 page FEATURES · Glass passivated chip junction GBU · Reliable low cost construction utilizing molded plastic technique · Ideal for printed circuit board · Low forward voltage drop · Low reverse leakage current · High surge current capability MECHANICAL DATA Case: Molded plastic, GBU Epoxy: UL 94V-O rate flame retardant Terminals: Leads solderable per MIL-STD-202, method 208 guaranteed Mounting position: Any Weight: 0.15ounce, 4.0gram Maximum Ratings and Electrical Characteristics Ratings at 25℃ ambient temperature unless otherwise specified. Single phase, half wave, 60HZ, resistive or inductive load. For capacitive load, derate current by 20%. Dimensions in millimeters DimMin Max A 21.8 22.3 B 3.5 4.1 C 7.4 7.9 D 1.65 2.16 E 2.25 2.75 G 1.02 1.27 H 4.83 5.33 J 17.5 18.0 K 4.2 X 45° L 18.3 18.8 M 3.30 3.56 N 0.46 0.56 P 0.76 1.0 - ~ ~ + A B K D E F G H J M N P L C BRIDGE RECTIFIERS GBU6005 THRU GBU610 F 2.05 2.3 · UL Recognized File # E469616 31 @IF=6A @IF=3A 1.1 Forward Voltage per element 120 6005 6.0 610 608 606 604 602 601 7.6 65 1.0 GBU GBU GBU SYMBOL VRRM VRWM VDC VRMS 35 70 140 280 420 560 700 VFM RθJA RθJL TJ,TSTG Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) Operating and Storage Temperature Range RMS Reverse Voltage -55to+150 ℃ uA Typical Junction Capacitance per leg pF ℃/W IR 5.0 500 A V IFSM UNITS V V A 1000 100 200 400 600 800 50 TYPE NUMBER GBU GBU GBU GBU Peak Reverse Current @T =25 At Rated DC Blocking Voltage @T =125 A ℃ ℃ A CJ Rating for fusing (t <8.3ms) I 2 t 59.7 A s 2 I 2 t Average Rectified Output Current (Note 1)@T =90℃ C (Note 2) Typical Thermal Resistance per leg (Note 3) 2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C. Note:1. Mounted on glass epoxy PC board with 1.3mm 2 solder pad. 3. Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink. IF(AV) http://www.trr-jx.com version: 02 |
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Similar Description - GBU6005_18 |
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