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FP6276B Datasheet(PDF) 9 Page - Feeling Technology Corp.

Part # FP6276B
Description  500kHz 6A High Efficiency Synchronous PWM Boost Converter
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Manufacturer  FEELING [Feeling Technology Corp.]
Direct Link  http://www.feeling-tech.com.tw/
Logo FEELING - Feeling Technology Corp.

FP6276B Datasheet(HTML) 9 Page - Feeling Technology Corp.

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FP6276B
This datasheet contains new product information.
Feeling Technology reserves the rights to modify the product specification without notice.
No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product.
Website: http://www.feeling-tech.com.tw
Rev. 0.66
9/12
Application Information
Inductor Selection
Inductance value is decided based on different condition. 1.5uH to 4.7µH inductor value is
recommended for general application circuit. There are three important inductor specifications, DC
resistance, saturation current and core loss. Low DC resistance has better power efficiency.
Also,
avoid inductor saturation which will cause circuit system unstable and lower core loss at 500KHz.
Capacitor Selection
The output capacitor is required to maintain the VO DC voltage. Low ESR capacitors are
preferred to reduce the output voltage ripple. Ceramic capacitor of X5R and X7R are recommended,
which have low equivalent series resistance (ESR) and wider operation temperature range.
Output Voltage Programming
The output voltage is set by a resistive voltage divider from the output voltage to FB. The output
voltage is:
 
2
R
1
R
1
V
6
.
0
V
OUT
Layout Considerations
1.
The power traces, consisting of the GND trace, the LX trace and the VIN trace should be kept
short, direct and wide.
2.
Layout LX switching node wide and short trace to reduce EMI.
3.
Place C1 near VIN pin as closely as possible to maintain input voltage steady and filter out
the pulsing input current.
4.
The resistive divider R1 and R2 must be connected to FB pin directly and as closely as
possible.
5.
FB is a sensitive node. Please keep it away from switching node LX.
6.
The GND of the IC, C1, C3 and C4 should be connected close together directly to a power
ground plane.


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