2003-07-31

Rev.2

Page 2

IDP09E60

IDB09E60

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

-

-

2.6

K/W

Thermal resistance, junction - ambient, leaded

-

-

62

SMD version, device on PCB:

@ min. footprint

-

-

-

35

62

-

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Reverse leakage current

-

-

-

-

50

750

µA

Forward voltage drop

-

-

1.5

1.5

2

-

V

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.