Ver: 6.6

Sep 25, 2002

TEL: 886-3-5788833

http://www.gmt.com.tw

2

G910/G911

Global Mixed-mode Technology Inc.

Absolute Maximum Ratings

(Note 1)

Input Voltage………………………………………….10V

Power Dissipation Internally Limited

(Note2)

Maximum Junction Temperature…………………150°C

Storage Temperature Range..……-65°C

Lead Temperature, Time for Wave Soldering

SOT89, SOT223, µTO92 Package……..…...260°C, 4s

SOT 89

SOT 223

µTO 92 & TO 92

Operating Conditions

(Note 1)

Input Voltage…………………………..…..………4V ~ 7V

Temperature Range………………….….0°C

Electrical Characteristics

PARAMETER

CONDITIONS

MIN

TYP

MAX UNITS

Output Voltage

+

3.234

3.3

3.366

V

Line Regulation

10

30

mV

42

60

Load Regulation

+

28

45

mV

Output Impedance

102

m

Ω

Quiescent Current

0.6

mA

Ripple Rejection

42

dB

0.65

+

0.35

V

Dropout Voltage

50

100

mV

ommended minimum footprint

400

Output Current

Continuous Test

0.53 inch leads soldered to PC Board

mA

Short Circuit Current

0.77

A

Over Temperature

125

°C

[

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are

conditions under which the device functions but the specifications might not be guaranteed. For guaranteed speci-

fications and test conditions see the Electrical Characteristics.

tance,

shutdown. For the G910 in SOT 89 package & µTO 92,TO 92,

156°C/W (See Recommended Minimum Footprint). The safe operation in SOT 89,µTO 92,TO 92 & SOT 223

package, it can see “Typical Performance Characteristics” (Safe Operating Area).

Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

Note4: The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the regu-

lator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 100mV below its nominal value, dropout

voltage is affected by junction temperature, load cur-

rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input volt-

age. The measurement is made under conditions of low

dissipation or by using pulse techniques such that av-

erage chip temperature is not significantly affected.

Load Regulation

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that average chip tem-

perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.