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BUK9225-55A Datasheet(PDF) 9 Page - NXP Semiconductors |
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BUK9225-55A Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 13 page Philips Semiconductors BUK9225-55A TrenchMOS™ logic level FET Product specification Rev. 01 — 17 April 2001 9 of 13 9397 750 08134 © Philips Electronics N.V. 2001. All rights reserved. 9. Package outline Fig 16. SOT428 (D-PAK). REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT428 TO-252 SC-63 98-04-07 99-09-13 0 10 20 mm scale Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads (one lead cropped) SOT428 E b2 D1 wA M bc b1 L1 L 13 2 D E1 HE L2 Note 1. Measured from heatsink back to lead. e1 e A A2 A A1 y seating plane mounting base A1 (1) D max. b D1 max. E max. HE max. w y max. A2 b2 b1 max. c E1 min. ee1 L1 min. L2 L A max. UNIT DIMENSIONS (mm are the original dimensions) 0.2 0.2 mm 2.38 2.22 0.65 0.45 0.89 0.71 0.89 0.71 1.1 0.9 5.36 5.26 0.4 0.2 6.22 5.98 4.81 4.45 2.285 4.57 10.4 9.6 0.5 0.7 0.5 6.73 6.47 4.0 2.95 2.55 |
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