PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

HPA00001D

ACTIVE

SOIC

D

8

None

CU NIPDAU

Level-1-220C-UNLIM

HPA00001DTR

ACTIVE

SOIC

D

8

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2808AD-1

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2808AD-2

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2808ADTR-1

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2808ADTR-2

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC2808AN-1

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

UCC2808AN-2

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

UCC2808APW-1

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC2808APW-2

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC2808APWTR-1

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC2808APWTR-2

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3808AD-1

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3808AD-2

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3808ADTR-1

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3808ADTR-2

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

UCC3808AN-1

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

UCC3808AN-2

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

UCC3808APW-1

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3808APW-2

ACTIVE

TSSOP

PW

8

150

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3808APWTR-1

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

UCC3808APWTR-2

ACTIVE

TSSOP

PW

8

2000

None

CU NIPDAU

Level-2-220C-1 YEAR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

9-Mar-2005

Addendum-Page 1