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K9F2816U0C-HCB0 Datasheet(PDF) 11 Page - Samsung semiconductor

Part # K9F2816U0C-HCB0
Description  16M x 8 Bit NAND Flash Memory
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K9F2816U0C-HCB0 Datasheet(HTML) 11 Page - Samsung semiconductor

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FLASH MEMORY
11
K9F2808U0C
AC Timing Characteristics for Command / Address / Data Input
NOTE : 1. If tCS is set less than 10ns, tWP must be minimum 35ns, otherwise, tWP may be minimum 25ns.
Parameter
Symbol
K9F2808U0C
Unit
CLE Set-up Time
tCLS
0-
ns
CLE Hold Time
tCLH
10
-
ns
CE Setup Time
tCS
0-
ns
CE Hold Time
tCH
10
-
ns
WE Pulse Width
tWP
25
-ns
ALE Setup Time
tALS
0-
ns
ALE Hold Time
tALH
10
-
ns
Data Setup Time
tDS
20
-
ns
Data Hold Time
tDH
10
-
ns
Write Cycle Time
tWC
50
-
ns
WE High Hold Time
tWH
15
-
ns
AC Characteristics for Operation
NOTE : 1. If reset command(FFh) is written at Ready state, the device goes into Busy for maximum 5us.
2. To break the sequential read cycle, CE must be held high for longer time than tCEH.
3. The time to Ready depends on the value of the pull-up resistor tied R/B pin.
Parameter
Symbol
K9F2808U0C
Unit
Data Transfer from Cell to Register
tR
-10
µs
ALE to RE Delay
tAR
10
-
ns
CLE to RE Delay
tCLR
10
-
ns
Ready to RE Low
tRR
20
-
ns
RE Pulse Width
tRP
25
-
ns
WE High to Busy
tWB
-
100
ns
Read Cycle Time
tRC
50
-
ns
CE Access Time
tCEA
-45
ns
RE Access Time
tREA
-30
ns
RE High to Output Hi-Z
tRHZ
-
30
ns
CE High to Output Hi-Z
tCHZ
-20
ns
RE or CE High to Output hold
tOH
15
-
ns
RE High Hold Time
tREH
15
-
ns
Output Hi-Z to RE Low
tIR
0-
ns
WE High to RE Low
tWHR
60
-
ns
Device Resetting Time(Read/Program/Erase)
tRST
-
5/10/500(1)
µs
K9F2808U0C-
Y,P,V,F only
Last RE High to Busy
(at sequential read)
tRB
-
100
ns
CE High to Ready(in case of interception by
CE at read)
tCRY
-
50 +tr(R/B)(3)
ns
CE High Hold Time(at the last serial read)(2)
tCEH
100
-
ns


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