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RD28F3208C3T90 Datasheet(PDF) 1 Page - Intel Corporation |
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RD28F3208C3T90 Datasheet(HTML) 1 Page - Intel Corporation |
1 / 70 page 3 Volt Intel® Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package Family Datasheet Product Features The 3 Volt Intel ® Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package (Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3 Stacked-CSP memory device incorporates flash memory and static RAM in one package with low voltage capability to achieve the smallest system memory solution form-factor together with high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection register and flexible block locking to enable next generation security capability. Combined with the Intel® Flash Data Integrator (Intel® FDI) software, the C3 Stacked-CSP memory device provides a cost-effective, flexible, code plus data storage solution. ■ Flash Memory Plus SRAM —Reduces Memory Board Space Required, Simplifying PCB Design Complexity ■ Stacked-Chip Scale Package (Stacked- CSP) Technology — Smallest Memory Subsystem Footprint —Area : 8 x 10 mm for 16Mbit (0.13 µm) Flash + 2Mbit or 4Mbit SRAM —Area : 8 x 12 mm for 32Mbit (0.13 µm) Flash + 4Mbit or 8Mbit SRAM — Height : 1.20 mm for 16Mbit (0.13 µm) Flash + 2Mbit or 4Mbit SRAM and 32Mbit (0.13um) Flash + 8Mbit SRAM — Height : 1.40 mm for 32Mbit (0.13 µm) Flash + 4Mbit SRAM —This Family also includes 0.25 µm and 0.18 µm technologies ■ Advanced SRAM Technology — 70 ns Access Time — Low Power Operation — Low Voltage Data Retention Mode ■ Intel ® Flash Data Integrator (FDI) Software — Real-Time Data Storage and Code Execution in the Same Memory Device — Full Flash File Manager Capability ■ Advanced+ Boot Block Flash Memory —70 ns Access Time at 2.7 V — Instant, Individual Block Locking —128 bit Protection Register —12 V Production Programming —Ultra Fast Program and Erase Suspend — Extended Temperature –25 °C to +85 °C ■ Blocking Architecture —Block Sizes for Code + Data Storage —4-Kword Parameter Blocks (for data) — 64-Kbyte Main Blocks (for code) — 100,000 Erase Cycles per Block ■ Low Power Operation — Async Read Current: 9 mA (Flash) — Standby Current: 7 µA (Flash) — Automatic Power Saving Mode ■ Flash Technologies — 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII and 0.13 µm ETOX™ VIII Flash Technologies — 28F160xC3, 28F320xC3 252636-001 February, 2003 Notice: This document contains information on new products in production. The specifications are subject to change without notice. Verify with your local Intel sales office that you have the lat- est datasheet before finalizing a design. |
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