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LMV242MDA Datasheet(PDF) 1 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LMV242MDA
Description  Dual Output, Quad-Band GSM/GPRS Power Amplifier Controller
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LMV242MDA Datasheet(HTML) 1 Page - National Semiconductor (TI)

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LMV242
Dual Output, Quad-Band GSM/GPRS Power Amplifier
Controller
General Description
The LMV242 is a power amplifier (PA) controller intended for
use within an RF transmit power control loop in GSM/GPRS
mobile phones. The LMV242 supports all single-supply PA’s
including InGaP, HBT and bipolar power amplifiers. The
device operates with a single supply from 2.6V to 5.5V.
Included in the PA controller are an RF detector, a ramp filter
and two selectable output drivers that function as error am-
plifiers for two different bands. The LMV242 input interface
consists two analog and two digital inputs. The analog inputs
are the RF input, Ramp voltage input. The digital inputs
perform the function of “Band Select” and “Shutdown/
Transmit Enable” respectively. The “Band Select” function
enables either of two outputs, namely OUT1 when BS =
High, or output OUT2 when BS = Low. The output that is not
enabled is pulled low to the minimum output voltage. The
LMV242 is active in the case TX_EN = High. When TX_EN
= Low the device is in a low power consumption shutdown
mode. During shutdown both outputs will be pulled low to the
minimum output voltage. Individual PA characteristics are
accommodated by a user selectable external RC combina-
tion.
The LMV242 is offered in fully tested die form as well as in a
10-lead LLP package and is therefore especially suitable for
small footprint PA module solutions.
Features
n
Support of InGaP HBT, bipolar technology
n
Quad-band operation
n
Shutdown mode for power save in R
X slot
n
Integrated ramp filter
n
50 dB RF detector
n
GPRS compliant
n
External loop compensation option
n
Accurate temperature compensation
n
LLP package 3x3 mm and fully tested die sales
Applications
n
GSM/GPRS/TDMA/TD_SCDMA mobile phone
n
Pulse RF control
n
Wireless LAN
n
GSM/GPRS power amplifier module
n
Transmit module
Typical Application
20079501
VIP® is a registered trademark of National Semiconductor Corporation.
July 2004
© 2004 National Semiconductor Corporation
DS200795
www.national.com


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