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SY58601U Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY58601U Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 10 page 3 Precision Edge® SY58600U Micrel, Inc. M9999-052505 hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings(1) Supply Voltage (V CC) .................................. –0.5V to +4.0V Input Voltage (V IN) ......................................... –0.5V to VCC CML Output Voltage (V OUT) ......... VCC –1.0V to VCC +0.5V Termination Current(3) Source or Sink Current on V T .................................... ±100mA Input Current Source or Sink Current on IN, /IN ........................ ±50mA Current (V REF) Source or Sink Current on V REF–AC .................. ±1.5mA Lead Temperature (soldering, 20 sec.) ................... +260 °C Storage Temperature (T S) ....................... –65°C to +150°C Operating Ratings(2) Supply Voltage (V CC) ...................... +2.375V to +2.625V or ............................................................ +3.0V to +3.6V Ambient Temperature (T A) ......................... –40°C to +85°C Package Thermal Resistance(4) MLF™ (θ JA) Still-Air ............................................................. 93 °C/W MLF™ (ψ JB) Junction-to-Board ............................................ 32 °C/W T A = –40°C to +85°C, unless otherwise noted. Symbol Parameter Condition Min Typ Max Units V CC Power Supply V CC = 2.5V 2.375 2.5 2.625 V V CC = 3.3V 3.0 3.3 3.6 V I CC Power Supply Current No Load, max. V CC, Note 6 45 65 mA R DIFF_IN Differential Input Resistance 80 100 120 Ω (IN-to-/IN) R IN Input Resistance 40 50 60 Ω (IN-to-V T, /IN-to-VT) V IH Input HIGH Voltage Note 7 V CC –1.6 V CC V (IN, /IN) V IL Input LOW Voltage 0 V IH –0.1 V (IN, /IN) V IN Input Voltage Swing See Figure 1a. 0.1 1.7 V (IN, /IN) V DIFF_IN Differential Input Voltage Swing See Figure 1b. 0.2 3.4 V |IN–, /IN| V T_IN In-to-V T 1.28 V (IN, /IN) V REF–AC Output Reference Voltage V CC –1.3 VCC –1.2 VCC –1.1 V Notes: 1. Permanent device damage may occur if the ratings in “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ψ JB uses 4-layer θ JA in still-air, unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. Includes current through internal 50 Ω pull-ups. 7. V IH (min) not lower than 1.2V. DC ELECTRICAL CHARACTERISTICS(5) |
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