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HMJE13001 Datasheet(PDF) 3 Page - Hi-Sincerity Mocroelectronics |
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HMJE13001 Datasheet(HTML) 3 Page - Hi-Sincerity Mocroelectronics |
3 / 4 page HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HA200213 Issued Date : 2002.06.01 Revised Date : 2005.02.05 Page No. : 3/4 HMJE13001 HSMC Product Specification TO-92 Dimension TO-92 Taping Dimension Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 3 1 A D B C I α1 E α2 α3 G H 2 F H2A H2A H2 H2 D2 A H W W1 H3 H4 H1 L1 L P2 P P1 F1F2 D1 D T2 T T1 DIM Min. Max. A 4.33 4.83 B 4.33 4.83 C 12.70 - D 0.36 0.56 E- *1.27 F 3.36 3.76 G 0.36 0.56 H- *2.54 I- *1.27 α1 - *5 ° α2 - *2 ° α3 - *2 ° *: Typical, Unit: mm 3-Lead TO-92 Plastic Package HSMC Package Code: A DIM Min. Max. A 4.33 4.83 D 3.80 4.20 D1 0.36 0.53 D2 4.33 4.83 F1,F2 2.40 2.90 H 15.50 16.50 H1 8.50 9.50 H2 - 1 H2A - 1 H3 - 27 H4 - 21 L- 11 L1 2.50 - P 12.50 12.90 P1 5.95 6.75 P2 50.30 51.30 T - 0.55 T1 - 1.42 T2 0.36 0.68 W 17.50 19.00 W1 5.00 7.00 Unit: mm Marking: Pb Free Mark Pb-Free: " . " (Note) Normal: None Control Code Date Code H 13 0 E 0 J 1 M Note: Green label is used for pb-free packing Pin Style: 1.Emitter 2.Collector 3.Base Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 |
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