HX6356
10
The 32K x 8 SRAM is offered in two custom 36-lead flat
packs (FP). The packages are constructed of multilayer
ceramic (Al
2O3) and feature internal power and ground
planes. The 36-lead flat packs also feature a non-conduc-
tive ceramic tie bar on the lead frame. The tie bar allows
electrical testing of the device, while preserving the lead
integrity during shipping and handling, up to the point of
lead forming and insertion.
On the bottom braze 36-lead FP, ceramic chip capacitors
can be mounted to the package by the user to maximize
supply noise decoupling and increase board packing den-
sity. These capacitors attach directly to the internal pack-
age power and ground planes. This design minimizes
resistance and inductance of the bond wire and package.
All NC (no connect) pins should be connected to VSS to
prevent charge build up in the radiation environment.
PACKAGING
36-LEAD FP PINOUT
36-LEAD FLAT PACK—Bottom Braze (22018131-001)
VSS
VDD
NWE
CE
A13
A8
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
VSS
VDD
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
NC
VDD
VSS
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
Top
View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
[1] Parts delivered with leads unformed
[2] At tie bar
[3] Lid tied to VSS
A
b
C
D
E
e
F
G
H
I
J
L
0.095 ± 0.014
0.008 ± 0.002
0.005 to 0.0075
0.650 ± 0.010
0.630 ± 0.007
0.025 ± 0.002 [2]
0.425 ± 0.005 [2]
0.525 ± 0.005
0.135 ± 0.005
0.030 ± 0.005
0.080 typ.
0.285 ± 0.015
M
N
O
P
R
S
T
U
V
W
X
Y
0.008 ± 0.003
0.050 ± 0.010
0.090 ref
0.015 ref
0.075 ref
0.113 ± 0.010
0.050 ref
0.030 ref
0.080 ref
0.005 ref
0.450 ref
0.400 ref
All dimensions are in inches [1]
Kovar
Lid [3]
Ceramic
Body
A
J
I
C
M
0.004
N
X
VDD
Optional
Capacitors
1
VSS
V
S
W
P
U
Y
VDD
VSS
O
T
R
Non-
Conductive
Tie-Bar
b
(width)
e
(pitch)
E
1
H
L
L
Top
View
22018131-001
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