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LX1744CLQ Datasheet(PDF) 2 Page - Microsemi Corporation

Part # LX1744CLQ
Description  Dual Output Boost - LED Driver / LCD Bias
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX1744CLQ Datasheet(HTML) 2 Page - Microsemi Corporation

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LX1744
PRODUCTION DATASHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Dual Output Boost – LED Driver / LCD Bias
I N T E GR A T ED
PRODUCT S
Copyright
© 2000
Rev. 1.1b, 2005-03-01
ABSOLUTE MAXI MUM RATI NGS
Supply Input Voltage ...........................................................................-0.3V to 7V
Feedback Input Voltage (VFB, VLFB).......................................-0.3V to VIN + 0.3V
Shutdown Input Voltage (VSHDN , VLSHDN)) ...........................-0.3V to VIN + 0.3V
PWM Input Amplitude (ADJ, BRT).......................................-0.3V to VIN + 0.3V
Analog Adjust Input Voltage (VADJ, VBRT).............................-0.3V to VIN + 0.3V
SRC Input Current ................................................................................ 800mARMS
Operating Temperature Range .........................................................-40
°C to 85°C
Maximum Operating Junction Temperature ................................................ 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
TH ERM A L DATA
LQ Plastic MLPQ 16-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
31
°C/W
PW Plastic TSSOP 14-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
90
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PI N OUT
LSHDN
REF
IN
FB
CS
ADJ
SW
DRV
SRC
OVP
BRT
GND
LFB
1
2
6
5
9
11
14
13
3
4
78
12
10
SHDN
PW PACKAGE
(Top View)
1
2
3
4
56
7
8
9
10
11
12
13
14
15
16
SW
SHDN1
FB
ADJ
LFB
OVP
CS
DRV
LQ PACKAGE
(Bottom View)
(“N.C.” = No Internal Connection)
RoHS / Pb-free 100% Matte Tin Lead Finish


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