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UCD7201 Datasheet(PDF) 9 Page - Texas Instruments |
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UCD7201 Datasheet(HTML) 9 Page - Texas Instruments |
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9 / 20 page  www.ti.com Thermal Information Circuit Layout Recommendations UCD7201 SLUS645B – FEBRUARY 2005 – REVISED JULY 2005 Note that the PowerPAD™ is not directly connected to any leads of the package. However, it is electrically The useful range of a driver is greatly affected by the and thermally connected to the substrate which is the drive power requirements of the load and the thermal ground of the device. The PowerPad™ should be characteristics of the device package. In order for a connected to the quiet ground of the circuit. power driver to be useful over a particular tempera- ture range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The UCD7K In a power driver operating at high frequency, it is family of drivers is available in PowerPAD™ TSSOP critical to minimize stray inductance to minimize and QFN/DFN packages to cover a range of appli- overshoot/undershoots and ringing. The low output cation requirements. Both have an exposed pad to impedance of these drivers produces waveforms with enhance thermal conductivity from the semiconductor high di/dt. This tends to induce ringing in the parasitic junction. inductances. It is advantageous to connect the driver device close to the MOSFETs. It is recommended As illustrated in Reference [2], the PowerPAD™ that the PGND and the AGND pins be connected to packages offer a leadframe die pad that is exposed at the PowerPad™ of the package with a thin trace. It is the base of the package. This pad is soldered to the critical to ensure that the voltage potential between copper on the PC board (PCB) directly underneath these two pins does not exceed 0.3 V. The use of the device package, reducing the TJC down to schottky diodes on the outputs to PGND and PVDD is 2.07°C/W. The PC board must be designed with recommended when driving gate transformers. thermal lands and thermal vias to complete the heat removal subsystem, as summarized in Reference [3]. 9 |
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