MC100LVEL30 MC100EL30

4–3

MOTOROLA

ECLinPS and ECLinPS Lite

DL140 — Rev 3

OUTLINE DIMENSIONS

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D–04

ISSUE E

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

0.510

0.299

0.104

0.019

0.035

0.012

0.009

7

°

0.415

0.029

0.499

0.292

0.093

0.014

0.020

0.010

0.004

0

°

0.395

0.010

12.95

7.60

2.65

0.49

0.90

0.32

0.25

7

°

10.55

0.75

12.65

7.40

2.35

0.35

0.50

0.25

0.10

0

°

10.05

0.25

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

1.27 BSC

0.050 BSC

–A

–

–B

–

1

10

11

20

–T

–

K

C

SEATING

PLANE

°

M

0.010 (0.25)

B

M

M

0.010 (0.25)

T

A

B

M

S

S

F

J

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MC100LVEL30/D

*MC100LVEL30/D*

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