Revision 2.1

Jan.

2004

8

BS616LV1615

BSI

R0201-BS616LV1615

ORDERING INFORMATION

PACKAGE DIMENSIONS

3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.

1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.

N

E

D

NOTES:

48

12.0

9.0

E1

D1

e

3.75

5.25

0.75

SIDE VIEW

D0.1

D1

SOLDER BALL 0.35±0.05

VIEW A

3.375

48 mini-BGA (9mm x 12mm)

Note:

BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products

for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support

systems and critical medical instruments.

BS616LV1615 X X

Z

Y Y

GRADE

SPEED

55: 55ns

70: 70ns

PKG MATERIAL

-: Normal

G: Green

P: Pb free

PACKAGE

F :BGA-48-0912