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BS616UV2019AIG85 Datasheet(PDF) 8 Page - Brilliance Semiconductor |
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BS616UV2019AIG85 Datasheet(HTML) 8 Page - Brilliance Semiconductor |
8 / 9 page Revision 1.1 Jan. 2004 8 R0201-BS616UV2019 ORDERING INFORMATION BSI BS616UV2019 PACKAGE DIMENSIONS 48 mini-BGA (6 x 8) D1 VIEW A 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. BALL PITCH e = 0.75 D 8.0 6.0 EN 48 3.75 E1 D1 5.25 NOTES: Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. BS616UV2019 X X Z Y Y GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC SPEED 85: 85ns 10: 100ns PKG MATERIAL -: Normal G: Green P: Pb free PACKAGE T: TSOP1-48 A: BGA-48-0608 D: DICE |
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