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1N4744AUR Datasheet(PDF) 1 Page - Microsemi Corporation |
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1N4744AUR Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page SURFACE MOUNT 1.0 W GLASS ZENER DIODES SCOTTSD A L E DIVISION 1N4728UR thru 1N4764AUR (or MLL4728A thru MLL4764A) DESCRIPTION APPEARANCE This surface mountable 1 watt Zener diode series is electrically equivalent to the 1N4728A thru 1N4764A registration in the DO-41 equivalent package except that it meets the JEDEC surface mount outline DO-213AB. It is an ideal selection for applications of high density and low parasitic requirements for voltage regulation. Standard voltage tolerance is +/- 5% with tighter tolerances available down to 1%. With its glass hermetic qualities, it may also be used for high reliability applications when required by a source control drawing (SCD). DO-213AB IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Electrically similar to the JEDEC registered 1N4728 thru 1N4764 zener series • Zener voltages available 3.3V to 100V • Standard voltage tolerances are +/- 5% with “A” suffix and 10 % with no suffix identification • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively • Options for screening in accordance with MIL-PRF- 19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. • Surface mount equivalents also available as SMAJ4728A to SMAJ4764A and SMAJ4728A to SMAJ4764A • Plastic body axial-leaded Zener equivalents are also available as 1N4728A to 1N4764A • Regulates voltage over a broad operating current and temperature range • Wide selection from 3.3 to 100 V • Leadless package for surface mounting • Ideal for high density mounting • Nonsensitive to ESD • Hermetically sealed glass package • Specified capacitance (see Figure 2) • Inherently radiation hard per MicroNote 050 MAXIMUM RATINGS MECHANICAL AND PACKAGING • Power dissipation at 25ºC: 1.0 watts (also see derating in Figure 1). • Operating and Storage temperature: -65ºC to +175ºC • Thermal Resistance: 50 ºC/W junction to end cap, or 130 ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page) • Steady-State Power: 1.00 watts at TEC < 125oC, or 1.00 watts at TA < 45 ºC when mounted on FR4 PC board and recommended footprint as described for thermal resistance (also see Figure 1) • Forward voltage @200 mA: 1.2 volts (maximum) • Solder Temperatures: 260 ºC for 10 s (max) • CASE: Hermetically sealed DO-213AB glass MELF • TERMINALS: Leads, tin-lead plated solderable per MIL-STD-750, method 2026 • POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation • MARKING: Cathode band only • TAPE & REEL optional: Standard per EIA-481-B with 12 mm tape, 1500 per 7 inch reel or 5000 per 13 inch reel (add “TR” suffix to part number) • WEIGHT: 0.05 grams • See package dimensions & recommended mounting pad on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2002 11-05-2003 REV C |
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