ADS1205

SBAS312A − JANUARY 2005 − REVISED APRIL 2005

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2

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to

damage because very small parametric changes could cause the device not to meet its published specifications.

Package/Ordering Information

For the most current package and ordering information, see the Package Option Addendum at the end of this document,

or see the TI web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

ADS1205

UNIT

Supply voltage, AGND to AVDD

−0.3 to 6

V

Supply voltage, BGND to BVDD

−0.3 to 6

V

Analog input voltage with respect to AGND

AGND − 0.3 to AVDD + 0.3

V

Reference input voltage with respect to AGND

AGND − 0.3 to AVDD + 0.3

V

Digital input voltage with respect to BGND

BGND − 0.3 to BVDD + 0.3

V

Ground voltage difference, AGND to BGND

±0.3

V

Voltage differences, BVDD to AGND

−0.3 to 6

V

Input current to any pin except supply

±10

mA

Power dissipation

See Dissipation Rating table

Operating virtual junction temperature range, TJ

−40 to +150

°C

Operating free-air temperature range, TA

−40 to +85

°C

Storage temperature range, TSTG

−65 to +150

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATINGS

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR

ABOVE TA = 25°C(1)

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

QFN-24 (4x4)

2193mW

21.929mW/

°C

1206mW

877.2mW

(1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for

informational purposes only.

RECOMMENDED OPERATING CONDITIONS

PARAMETER

MIN

NOM

MAX

UNIT

Supply voltage, AGND to AVDD

4.5

5

5.5

V

Supply voltage, BGND to BVDD

Low-Voltage Levels

2.7

3.6

V

Supply voltage, BGND to BVDD

5V Logic Levels

4.5

5

5.5

V

Reference input voltage

0.5

2.5

2.6

V

Operating common-mode signal

−IN

2.5

V

Analog inputs

+IN − (−IN)

±0.8 × REFIN

V

External clock(1)

16

20

24

MHz

Operating junction temperature range, TJ

−40

105

°C

(1) With reduced accuracy, clock can go from 1MHz up to 33MHz; see Typical Characteristics.