VITESSE

SEMICONDUCTOR CORPORATION

G52156-0, Rev 3.0

Page 7

05/01/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Preliminary Data Sheet

VSC7924

SONET/SDH 2.5Gb/s Laser Diode Driver

Figure 6: Pad Assignments for VSC7924 Die

1) Die size = 1620µm x 1620µm

2) Actual die size = 1720µm x 1720µm (after the die are cut up)

3) Pad size = 120µm x 120µm

4) Pad pitch = 150µm

5) Space between pads = 30µm

PAD 25

PAD 24

PAD 23

PAD 22

PAD 21

PAD 20

PAD 19

PAD 18

VIB

GND0

OUT

OUT

GND0

NOUT

VSS

VSS

PAD 1

PAD 34 PAD 33

PAD 32

PAD 31 PAD 30

PAD 29

PAD 28

PAD 27

PAD 26

VREF

VSS

VSS

VSS

VSS

VIP

MIP

MIP

MIB

PAD 2

PAD 3

PAD 4

PAD 5

PAD 6

PAD 7

PAD 8

DIN

VSS

DIN

GND

GND

GND

VSS

VSS

PAD 9

PAD 10

PAD 11

PAD 12 PAD 13 PAD 14 PAD 15

PAD 16

PAD 17

TERM

TERM

GND

GND

GND

GND

GND

NMARK MARK

120

120

150

30

1720

1620

1720

1620

50

50

Dimensions in micrometers.