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MLL14KESD40 Datasheet(PDF) 1 Page - Microsemi Corporation |
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MLL14KESD40 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 4 page SURFACE MOUNT TVS SCOTTSD A L E DIVISION MLL14KESD5.0 thru MLL14KESD170A DESCRIPTION APPEARANCE These surface mount Transient Voltage Suppressor (TVS) devices feature the ability to clamp dangerous high voltage short-term transients such as produced by direct or radiated electro-static discharge phenomena before entering sensitive component regions of a circuit design. They are small economical TVSs targeted primarily for short term transients below a few microseconds while still achieving significant peak-pulse-power capability as seen in Figure 1. DO-213AB IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Excellent protection in clamping direct ESD level transients in excess of 40,000 V per MIL-STD-750, Method 1020 (approx. 150 ns exponential wave) • Absorbs ESD level transients of 14,000 Watts per MIL-STD-750, Method 1020 (approximately 150 ns exponential wave, or one microsecond transients up to 4000 watts. See Figure #1 and #2 for overall transient Peak Pulse Power. • Clamps Transients in less than 100 picoseconds • Working Stand-off Voltage range of 5V to 170V • Hermetic DO-213AB package. Also available in axial-leaded DO-41package (see separate data sheet for 14KESD5.0 series) • Protects Sensitive circuits from short duration fast rise time transients such as Electrostatic Discharge (ESD) or Electrical Fast Transients (EFT) • Minimal capacitance (See Figure #3) • Small surface-mount footprint for high density mounting • Bidirectional features available by adding a “C” or “CA” suffix to part number MAXIMUM RATINGS MECHANICAL AND PACKAGING • 4000 Watts for One Microsecond Square Wave or 14,000 watts per ESD Wave form of MIL-STD-750, method 1020. • See Surge Rating curve in Figures #1 and 2. • Operating and storage temperature –65oC to 175oC • Thermal Resistance: 40 ºC/W junction to end cap, or 120 ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page) • Steady-State Power: 1.50 watts at TEC < 115oC, or 1.25 watts at TA = 25 ºC when mounted on FR4 PC board and recommended footprint as described for thermal resistance (also see Figure 1) • Derate at 22.8 W/oC above 25oC for PPP (1µs) and at 15 mW/ oC above 75oC for dc power. • Forward Surge Current 500 amps for 1µs at TL = 25 oC (rise time > 100 ns). • CASE: Hermetically sealed DO-213AB glass MELF package • TERMINALS: End caps, tin-lead plated solderable per MIL-STD-750, method 2026 • POLARITY: Cathode indicated by band. • MARKING: Cathode band only • TAPE & REEL optional: Standard per EIA-481-B with 12 mm tape, 1500 per 7 inch reel or 5000 per 13 inch reel (add “TR” suffix to part number) • WEIGHT: 0.05 grams • See package dimensions on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2002 10-03-2003 REV A |
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