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MPC852TZT66 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

Part # MPC852TZT66
Description  Hardware Specifications
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC852TZT66 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

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MPC852T Hardware Specifications, Rev. 3.1
6
Freescale Semiconductor
Power Dissipation
5
Power Dissipation
Table4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
mode, where CPU frequency is twice bus speed.
Table 3. MPC852T Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction to ambient 1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Natural convection
Single layer board (1s)
R JA
2
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal
49
°C/W
Four layer board (2s2p)R JMA
3
3
Per JEDEC JESD51-6 with the board horizontal
32
Air flow (200 ft/min)
Single layer board (1s)R JMA
3
41
Four layer board (2s2p)R JMA
3
29
Junction to board 4
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
R JB
24
Junction to case 5
5
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to
case thermal resistance is a simulated value from the junction to the exposed pad without contact
resistance.
R JC
13
Junction to package top 6
6
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2
Natural convection
JT
3
Air flow (200 ft/min)
JT
2
Table 4. Power Dissipation (PD)
Die Revision
Bus Mode
Frequency
(MHz)
Typical 1
1
Typical power dissipation is measured at 1.9 V.
Maximum 2
Unit
0
1:1
50
110
140
mW
66
150
180
mW
2:1
66
140
160
mW
80
170
200
mW
100
210
250
mW


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