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MC33269DTRK Datasheet(PDF) 11 Page - ON Semiconductor |
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MC33269DTRK Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 12 page MC33269, NCV33269 http://onsemi.com 11 PACKAGE DIMENSIONS SOT−223 ST SUFFIX CASE 318E−04 ISSUE N 1.5 0.059 mm inches SCALE 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* A1 b1 D E b e e1 4 12 3 0.08 (0003) A L1 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. HE DIM A MIN NOM MAX MIN MILLIMETERS 1.50 1.63 1.75 0.060 INCHES A1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 D 6.30 6.50 6.70 0.249 E 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 NOM MAX L1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 HE − − e1 0 10 0 10 q q L L 0.20 −−− −−− 0.008 −−− −−− |
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