MECHANICAL DATA

MPQF113C − DECEMBER 2001 − REVISED AUGUST 2002

POST OFFICE BOX 655303

RGQ (S−PQFP−N56)

PLASTIC QUAD FLATPACK

4203438/D 08/2002

Bottom View

56X 0,23

7,85

8,15

D

43

42

56

1

0,08 C

1

7,65

7,85

56

0,50

A

+0,07

−0,05

0,05

0,10

M C

M CB

29

28

14

15

0,30

Seating Plane

0,00

0,05

C

7,85

8,15

A

B

5,35

5,05

4,35

4,65

43

42

29

28

15

14

0,80

1,00

Pin 1 Identifier

Exposed Thermal Die Pad

Pin 1 Identifier

4X

0,50

6,50

56X

Sq

0,20 Nominal

Lead Frame

NOTES: A.

All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. QFN (Quad Flatpack No-Lead) Package configuration.

D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane.

This pad may be electrically connected to ground.

E. Package registration with JEDEC MO-220 variation VLLD-2.