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FN7430.1

May 13, 2005

Power Supply Bypassing and Printed Circuit

Board Layout

As with any high frequency device, good printed circuit

board layout is necessary for optimum performance. Ground

plane construction is highly recommended, lead lengths

should be as short as possible, and the power supply pins

must be well bypassed to reduce the risk of oscillation. For

connected to ground, one 0.1µF ceramic capacitor should be

ground. One 4.7µF capacitor may be used for multiple

devices. This same capacitor combination should be placed

at each supply pin to ground if split supplies are to be used.

Important Note: The metal plane used for heat sinking of

the device is electrically connected to the negative

thermal pad can be connected to ground. Otherwise, the

thermal pad must be isolated from any other power

planes.

EL5129, EL5329