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ISL59444IB-T13 Datasheet(PDF) 7 Page - Intersil Corporation |
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ISL59444IB-T13 Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 11 page 7 FN7451.1 September 21, 2005 FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Pin Descriptions PIN NUMBER PIN NAME EQUIVALENT CIRCUIT DESCRIPTION 1 IN0 Circuit 1 Input for channel 0 2, 6, 8 NIC Not Internally Connected; it is recommended this pin be tied to ground to minimize crosstalk. 3 IN1 Circuit 1 Input for channel 1 4 GND Circuit 4 Ground pin 5 IN2 Circuit 1 Input for channel 2 7 IN3 Circuit 1 Input for channel 3 9 V - Circuit 4 Negative Power Supply 10 LE1 Circuit 2 Synchronized channel switching: When LE1 is low, the master control latch loads the next switching address. The Mux Amp is configured for this address when LE2 goes low. Synchronized operation results when LE2 is the inverse of LE1. Channel selection is asynchronous (changes with any control signal change) if both LE1 and LE2 are both low. 11 LE2 Circuit 2 Synchronized channel switching: When LE2 is low, the newly selected channel, stored in the master latch via LE1 is selected. Synchronized operation results when LE2 is the inverse of LE1. Channel selection is asynchronous (changes with any control signal change) if both LE1 and LE2 are both low. 12 OUT Circuit 3 Output 13 HIZ Circuit 2 Output disable (active high); there are internal pull-down resistors, so the device will be active with no connection; "HI" puts the output in high impedance state. 14 S1 Circuit 2 Channel selection pin MSB (binary logic code) 15 S0 Circuit 2 Channel selection pin LSB (binary logic code) 16 V+ Circuit 4 Positive power supply Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = 25°C, unless otherwise specified. (Continued) 1.250W θ JA =8 0°C /W SO 16 (0.1 50 ”) 1.4 1.2 1 0.8 0.6 0.2 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.4 θ JA = 11 0°C /W SO 16 (0.1 50 ”) 1 0.9 0.8 0.6 0.4 0.1 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.2 0.7 0.3 0.5 909mW ISL59444 |
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