8

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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

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For information regarding Intersil Corporation and its products, see www.intersil.com

FN8083.0

May 6, 2005

ISL95310

Packaging Information

10 Lead MSOP, Package Code

1

2

3

45

0.0197 [0.50] BSC

0.1970 [5.00]

(S)

0.1890 [4.80]

10

9

8

76

0.0374 [0.95]

0.0295 [0.75]

4

0.0059 [0.15]

(S)

0.0020 [0.05]

0.0433 [1.10] MAX.

0.0039 [0.10]

MAX.

(S)

0.0106 [0.27]

0.0067 [0.17]

2

0.1220 [3.10]

0.1142 [2.90]

0.0098 [0.25]

A

A

0°-6°

3

0.1220 [3.10]

0.1142 [2.90]

SECTION A-A

GAUGE PLANE

0.1220 [3.10]

0.1142 [2.90]

BASE

4

0.0106 [0.27]

0.0067 [0.17]

WITH

PLATING

0.0050 [0.127]

0.0091 [0.23]

0.0051 [0.13]

WITH PLATING

0.0080 [0.203]

REF

METAL

NOTES:

1. Package dimensions conform to JEDEC specification MO-187BA.

2.

Does not include mold flash, protrusion

or gate burrs, mold flash protrusions

or gate burrs shall not exceed 0.15 mm per side.

3.

Does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side.

4.

Does not include dambar protrusion. Allowable dambar protrusion shall be 0.8 mm.

5. Lead span/stand-off height/coplanarity are considered as special characteristics.

6. Controlling dimensions in inches [mm].

2

3

4

3

0.0276 [0.70]

0.0157 [0.40]