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MT6L58AE Datasheet(PDF) 2 Page - Toshiba Semiconductor

Part # MT6L58AE
Description  TRANSISTOR SILICON NPN EPITAXIAL PLANAR TYPE VHF~UHF BAND LOW NOISE AMPLIFIER APPLICATIONS
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

MT6L58AE Datasheet(HTML) 2 Page - Toshiba Semiconductor

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MT6L58AE
2003-07-31
2
Electrical Characteristics Q1 (Ta
==== 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Collector cut-off current
ICBO
VCB = 5 V, IE = 0
0.1
µA
Emitter cut-off current
IEBO
VEB = 1 V, IC = 0
1
µA
DC current gain
hFE
VCE = 1 V, IC = 5 mA
70
140
Transition frequency
fT
VCE = 3 V, IC = 5 mA
7
10
GHz
S21e
2 (1)
VCE = 1 V, IC = 5 mA, f = 2 GHz
7.5
Insertion gain
S21e
2 (2)
VCE = 3 V, IC = 7 mA, f = 2 GHz
4.5
8
dB
NF (1)
VCE = 1 V, IC = 3 mA, f = 2 GHz
1.7
3
Noise figure
NF (2)
VCE = 3 V, IC = 3 mA, f = 2 GHz
1.6
3
dB
Reverse transfer capacitance
Cre
VCB = 1 V, IE = 0, f = 1 MHz
(Note 2)
0.35
0.75
pF
Note 2: Cre is measured by 3 terminal method with capacitance bridge.
Electrical Characteristics Q2 (Ta
==== 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Collector cut-off current
ICBO
VCB = 5 V, IE = 0
0.1
µA
Emitter cut-off current
IEBO
VEB = 1 V, IC = 0
1
µA
DC current gain
hFE
VCE = 1 V, IC = 5 mA
80
160
fT (1)
VCE = 1 V, IC = 5 mA
5
7
Transition frequency
fT (2)
VCE = 3 V, IC = 10 mA
7
10
GHz
S21e
2 (1)
VCE = 1 V, IC = 5 mA, f = 2 GHz
5
Insertion gain
S21e
2 (2)
VCE = 3 V, IC = 20 mA, f = 2 GHz
3
6.5
dB
NF (1)
VCE = 1 V, IC = 5 mA, f = 2 GHz
1.7
3
Noise figure
NF (2)
VCE = 3 V, IC = 7 mA, f = 2 GHz
1.4
2.2
dB
Reverse transfer capacitance
Cre
VCB = 1 V, IE = 0, f = 1 MHz
(Note 2)
0.8
1.15
pF
Note 2: Cre is measured by 3 terminal method with capacitance bridge.
Handling Precaution
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment
is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other
objects that come into direct contact with devices should be made of anti-static materials.


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