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VSM0805RFST Datasheet(PDF) 2 Page - Vishay Siliconix

Part # VSM0805RFST
Description  Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

VSM0805RFST Datasheet(HTML) 2 Page - Vishay Siliconix

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For technical questions in the Americas, contact foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
www.vishay.com
23
VSM0805
Vishay Foil Resistors
Document Number: 63061
Revision 17-Aug-04
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
SALES
Bulk Metal
® Foil Technology
Discrete Surface Mount Chip Resistors
MODEL
CHIP SIZE
RESISTANCE VALUE
TOLERANCE
TERMINATION
PACKAGING
VSM
0805
RESISTANCE
LETTER
MULTIPLIER
T ± 0.01%
S - Lead (Pb)-free
T = Tape and
RANGE
DESIGNATOR
FACTOR
Q ± 0.02%
B - Tin/Lead
Reel
A ± 0.05%
W = Waffle
5Ω to <1KΩ
R
x 1.0
B ± 0.1%
PacK
Example: 249R00 = 249Ω
C ± 0.25%
D ± 0.5%
F ± 1.0%
T
W
L
D
T
W
L
1K to 12KΩ
K
x 103
Example: 10K000 = 10.0KΩ
FIGURE 3 - RECOMMENDED MOUNTING
CHIP
POWER MAXIMUM RESISTANCE MAXIMUM
SIZE
L
W
T
D
+ 70
°C VOLTAGE
RANGE
WEIGHT
Z*
G*
X*
± 0.005 (0.13) ± 0.005 (0.13) MAXIMUM ± 0.005 (0.13)
(mW)
(V)
(
)(mG)
± 0.004 (0.10) ± 0.004 (0.10) ± 0.004 (0.10)
0805
0.080 (2.03)
0.050 (1.27) 0.025 (0.64) 0.015 (0.38)
50
22
5.5 - 12K
6
0.122 (3.10)
0.028 (0.70)
0.050 (1.27)
*Land Pattern Dimensions (Z, G, X) are per IPC-782A
TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters)
TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS
FIGURE 2 - POWER DERATING CURVE
125
100
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
–55°C
+70°C
Rated Power
Footprint
G
Z
X
Top View
Bottom View
Recommended Land Pattern
25% to 85% of T
A low profile solder fillet is recommended
to avoid unnecessary stresses along
top edge of metallization. IR and vapor
phase reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.


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