1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
HI-RELIABILITY PRODUCT
WS512K32V-XXX
512Kx32 SRAM 3.3V MODULE
PRELIMINARY*
s Low Power CMOS
s TTL Compatible Inputs and Outputs
s Fully Static Operation:
• No clock or refresh required.
s Three State Output.
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s Weight
WS512K32V-XG2TX - 8 grams typical
WS512K32V-XG1UX - 5 grams typical
WS512K32NV-XH1X - 13 grams typical
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
FEATURES
s Access Times of 15, 17, 20ns
s Low Voltage Operation
s Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high,
(Package 509)
• 68 lead, 23.9mm (0.940" sq.) Low Profile CQFP (G1U),
3.56mm (0.140") high, (Package 519)
s Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8
s Commercial, Industrial and Military Temperature Ranges
s Low Voltage Operation:
• 3.3V
± 10% Power Supply
PIN CONFIGURATION FOR WS512K32NV-XH1X
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A18
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A3
A4
A5
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
TOP VIEW
BLOCK DIAGRAM
512K x 8
8
I/O 0-7
CS1
512K x 8
8
I/O 8-15
2
512K x 8
8
I/O 16-23
3
512K x 8
8
I/O 24-31
4
A 0-18
OE
WE
CS
WE
CS
WE
CS
WE
12
3
4
May 2001 Rev. 6
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