GF1A thru GF1M

Vishay Semiconductors

formerly General Semiconductor

Document Number 88617

www.vishay.com

08-Jul-02

1

Surface Mount Glass Passivated Rectifier

Reverse Voltage 50 to 1000V

Forward Current 1.0A

DO-214BA (GF1)

Parameter

Symbol GF1A GF1B GF1D GF1G GF1J GF1K GF1M

Unit

Device marking code

GA

GB

GD

GG

GJ

GK

GM

Maximum repetitive peak reverse voltage

50

100

200

400

600

800

1000

V

Maximum RMS voltage

35

70

140

280

420

560

700

V

Maximum DC blocking voltage

50

100

200

400

600

800

1000

V

1.0

A

Peak forward surge current 8.3ms single half sine-wave

30

A

superimposed on rated load (JEDEC Method)

R

ΘJA

80

°C/W

R

ΘJL

26

Operating junction and storage temperature range

–65 to +175

°C

Parameter

Symbol GF1A GF1B GF1D GF1G GF1J GF1K GF1M

Unit

Maximum instantaneous forward voltage at 1.0A

1.10

1.20

V

Maximum DC reverse current

5.0

µA

at rated DC blocking voltage

50

Typical reverse recovery time at

3.0

µs

Typical junction capacitance at 4.0V, 1MHz

15

pF

Note: (1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas

Features

• Plastic package has Underwriters Laboratories

Flammability Classification 94V-0

• Ideal for surface mount automotive applications

• High temperature metallurgically bonded construction

• Cavity-free glass passivated junction

• Capable of meeting environmental standards of

MIL-S-19500

• Built-in strain relief • Easy pick and place

• High temperature soldering guaranteed:

450°C/5 seconds at terminals.

• Complete device submersible temperature of 265°C for

10 seconds in solder bath

Mechanical Data

Case: JEDEC DO-214BA, molded plastic over glass body

Terminals: Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity: Color band denotes cathode end

Mounting Position: Any

Weight: 0.0048 oz, 0.120 g

®

Dimensions in inches and (millimeters)

Glass-plastic encapsulation technique is covered by

Patent No. 3,996,602, brazen-lead assembly by Patent

No. 3,930,306 and lead forming by Patent No. 5,151,846

0.167 (4.24)

0.187 (4.75)

0.0065 (0.17)

0.015 (0.38)

0.030 (0.76)

0.060 (1.52)

0.196 (4.98)

0.226 (5.74)

0.094 (2.39)

0.114 (2.90)

0.100 (2.54)

0.118 (3.00)

0.040 (1.02)

0.066 (1.68)

0.098 (2.49)

0.108 (2.74)

0.006 (0.152) TYP.

0.094 MAX.

(2.38 MAX.)

0.220

(5.58) REF

0.066 MIN.

(1.68 MIN.)

0.052 MIN.

(1.32 MIN.)

Mounting Pad Layout

Patented*