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HA-5147883 Datasheet(PDF) 5 Page - Intersil Corporation |
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HA-5147883 Datasheet(HTML) 5 Page - Intersil Corporation |
5 / 9 page 5 Die Characteristics DIE DIMENSIONS: 104.3 x 65 x 19 mils 2650 x 1650 x 483 µm METALLIZATION: Type: Al, 1% Cu Thickness: 16k Å ± 2kÅ GLASSIVATION: Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.) Silox Thickness: 12kÅ ± 2kÅ Nitride Thickness: 3.5kÅ ± 1.5kÅ WORST CASE CURRENT DENSITY: 3.6 x 105A/cm2 at 15mA This device meets Glassivation Integrity Test Requirement per MIL-STD-883 Method 2021 and MIL-I-38535 Paragraph 30.5.5.4. SUBSTRATE POTENTIAL (Powered Up): V- TRANSISTOR COUNT: 63 PROCESS: Bipolar Dielectric Isolation Metallization Mask Layout HA-5147/883 BAL BAL V+ OUT NC V- +IN -IN HA-5147/883 Spec Number 511009-883 |
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