Chip Silicon Rectifier

FFM101-MH THRU FFM107-MH

Fast recovery type

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECSOD-123H

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.0393 gram

(V)

(V)

(V)

(V)

(nS)

(

FFM101-MH

F1

50

35

50

FFM102-MH

F2

100

70

100

FFM103-MH

F3

200

140

200

FFM104-MH

F4

400

280

400

FFM105-MH

F5

600

420

600

250

FFM106-MH

F6

800

560

800

FFM107-MH

F7

1000

700

1000

500

150

SYMBOLS

MARKING

CODE

1.3

-55 to +150

Operating

temperature

*1

*2

*3

*4

*5

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

Ambient temperature = 55

1.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

25

A

25

5.0

uA

100

uA

Thermal resistance

Junction to ambient

42

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

15

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

*5 Reverse recovery time

Formosa MS

0.146(3.7)

0.130(3.3)

0.012(0.3) Typ.

0.071(1.8)

0.055(1.4)

0.035(0.9)

0.028(0.7)

0.031(0.8) Typ.

Dimensions in inches and (millimeters)

SOD-123H

0.031(0.8) Typ.