Chip Silicon Rectifier

HFM101-L THRU HFM107-L

Ultra fast recovery type

Features

Plastic package has Underwriters Laboratory

FlammabilityClassification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDEC DO-214AC

Terminals : Solder plated, s olderable per MIL-STD-750,

Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : 0.0015 ounce, 0.05 gr am

(V)

(V)

(V)

(V)

(nS)

(

HFM101-L

H11

50

35

50

1.0

HFM102-L

H12

100

70

100

HFM103-L

H13

200

140

200

HFM104-L

H14

400

280

400

1.3

HFM105-L

H15

600

420

600

HFM106-L

H16

800

560

800

HFM107-L

H17

1000

700

1000

SYMBOLS

MARKING

CODE

50

75

1.7

-55 to +150

Operating

temperature

*1

*2

*3

*4

*5

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

Ambient temperature = 50

1.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

30

A

25

5.0

uA

150

uA

Thermal resistance

Junction to ambient

32

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

20

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

*5 Reverse recovery time

Formosa MS

0.205(5.2)

0.189(4.8)

0.012(0.3) Typ.

0.110(2.8)

0.094(2.4)

0.181(4.6)

0.165(4.2)

0.075(1.9)

0.067(1.7)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA-L