Chip Silicon Rectifier

HFM101 thru HFM108

Fast recovery type

Features

Plastic package has Underwriters Laboratory

FlammabilityClassification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDEC DO-214AC

Terminals : Solder plated, s olderable per MIL-STD-750,

Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : 0.0015 ounce, 0.05 gr am

(V)

(V)

(V)

(V)

(nS)

(

HFM101

H11

50

35

50

HFM102

H12

100

70

100

HFM103

H13

200

140

200

HFM104

H14

300

210

300

HFM105

H15

400

280

400

HFM106

H16

600

420

600

HFM107

H17

800

560

800

HFM108

H18

1000

700

1000

-55 to +150

Operating

temperature

*1

*2

*3

*4

*5

50

1.0

1.3

70

SYMBOLS

MARKING

CODE

1.85

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

Ambient temperature = 50

1.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

30

A

25

5.0

uA

150

uA

Thermal resistance

Junction to ambient

R

32

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

20

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

*5 Reverse recovery time

PATENT PUBLICATION NO. 37116

0.185(4.8)

0.177(4.4)

0.012(0.3) Typ.

0.110(2.8)

0.094(2.4)

0.165(4.2)

0.150(3.8)

0.067(1.7)

0.060(1.5)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA