7 / 57 page
v3.1
7
54S X Fam ily F P G A s
Othe r Archit ectu r al Fea tur e s
Technology
Actel’s SX family is implemented on a high-voltage twin-well
CMOS process using 0.35
µ design rules. The metal-to-metal
antifuse is made up of a combination of amorphous silicon
and dielectric material with barrier metals and has a
programmed
(“on”
state)
resistance
of
25
Ω with
capacitance of 1.0 fF for low signal impedance.
Figure 5 • DirectConnect and FastConnect for Type 1 SuperClusters
Figure 6 • DirectConnect and FastConnect for Type 2 SuperClusters
Routing Segments
• Typically 2 antifuses
• Max. 5 antifuses
Fast Connect
• One antifuse
• 0.4 ns routing delay
Direct Connect
• No antifuses
• 0.1 ns routing delay
Type 2 SuperClusters
Routing Segments
• Typically 2 antifuses
• Max. 5 antifuses
Fast Connect
• One antifuse
• 0.4 ns routing delay
Direct Connect
• No antifuses
• 0.1 ns routing delay