3

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2010

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size (

µm)

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

opening (

µm)

1100 x 1000

150 µm

113

70 x 70

Pad Number

Pad Name

Description

Pin Coordinates (µm)

A

VRXC

Common Receive Switch

Control Voltage

195, 126

B

VRX4

RX4 Control Voltage

315, 126

C

VTX2

TX2 Control Voltage

440, 126

D

VRX3

RX3 Control Voltage

556, 126

E

VRX1

RX1 Control Voltage

675, 126

F

VRX2

RX2 Control Voltage

795, 126

G

VTX1

TX1 Control Voltage

919, 126

H

TX2

TX2 RF Output

108, 904

I

TX1

TX1 RF Output

108, 242

J

ANT

Antenna

474, 912

K

RX4

RX4 RF Output

988, 880

L

RX3

RX3 RF Output

988, 750

M

RX2

RX2 RF Output

988, 420

N

RX1

RX1 RF Output

988, 290

O

GND

Ground 1

108, 514

P

GND

Ground 2

108, 627

Q

GND

Ground 3

988, 525

J

K

L

M

N

A

B

C

D

E

F

G

H

I

O

P

Q