Preliminary Data Sheet

2.2

2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Email: sales@filcsi.com

Website: www.filcs.com

FMS2017

Absolute Maximum Ratings:

Parameter

Symbol

Absolute Maximum

Max Input Power

Pin

+36dBm

Control Voltage

Vctrl

+5V

Operating Temperature

Toper

-40°C to +100°C

Storage Temperature

Tstor

-55°C to +150°C

Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the

device.

Truth Table:

State

V1

V2

V3

V4

PATH(S)

1

High

Low

Low

Low

RX-ANT1

2

Low

High

Low

Low

RX-ANT2

3

Low

Low

High

Low

TX-ANT2

4

Low

Low

Low

High

TX-ANT1

5

Low

High

Low

High

TX-ANT1 & RX-ANT2

6

High

Low

High

Low

TX-ANT2 & RX-ANT1

Note:

‘High’

= +2.4V to +3.3V

‘Low’

= 0V to +0.2V

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size (

µm)

Die Thickness (

µm)

Min. Bond Pad

Pitch (

µm)

Min. Bond pad

opening (

µm)

930x600

150

225

85x85

Pad

Ref

Pad

Name

Description

Pin Coordinates

(µm)

A

ANT1

Antenna 1

(155, 300)

B

RX

Receive

(465, 90)

C

ANT2

Antenna 2

(775, 300)

D

TX

Transmit

(465, 510)

E

V1

Vctrl1 (A1 to RX)

(155, 90)

F

V2

Vctrl2 (A2 to RX)

(775, 90)

G

V3

Vctrl3 (TX to A2)

(775, 510)

H

V4

Vctrl4 (A1 to TX)

(155, 510)

A

B

C

D

G

F

E

H