v3.1
3
54S X Fam ily F P G A s
Pr oduc t Plan
Speed Grade*
Application
Std
–1–2–3
C
I†
M•
A54SX08 Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
✔
✔✔✔
✔✔
—
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
✔
✔✔✔
✔✔
—
144-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
—
144-Pin Fine Pitch Ball Grid Array (FBGA)
✔
✔✔✔
✔✔
—
176-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
—
208-Pin Plastic Quad Flat Pack (PQFP)
✔
✔✔✔
✔✔
—
A54SX16 Device
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
✔
✔✔✔
✔✔
P
176-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
P
208-Pin Plastic Quad Flat Pack (PQFP)
✔
✔✔✔
✔✔
P
A54SX16P Device
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
✔
✔✔✔
✔✔
—
144-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
—
176-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
—
208-Pin Plastic Quad Flat Pack (PQFP)
✔
✔✔✔
✔✔
—
A54SX32 Device
144-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
P
176-Pin Thin Quad Flat Pack (TQFP)
✔
✔✔✔
✔✔
P
208-Pin Plastic Quad Flat Pack (PQFP)
✔
✔✔✔
✔✔
P
313-Pin Plastic Ball Grid Array (PBGA)
✔
✔✔✔
✔✔
—
329-Pin Plastic Ball Grid Array (PBGA)
✔
✔✔✔
✔✔
—
Contact your Actel sales representative for product availability.
Applications:C = CommercialAvailability:✔
= Available*Speed Grade:–1
= Approx. 15% faster than Standard
I
= Industrial
P
= Planned
–2
=
Approx. 25% faster than Standard
M
= Military
—
= Not Planned
–3
=
Approx. 35% faster than Standard
† Only Std, –1, –2 Speed Grade
• Only Std, –1 Speed Grade
Plastic Device Reso urce s
User I/Os (including clock buffers)
Device
PLCC
84-Pin
VQFP
100-Pin
PQFP
208-Pin
TQFP
144-Pin
TQFP
176-Pin
PBGA
313-Pin
PBGA
329-Pin
FBGA
144-Pin
A54SX08
69
81
130
113
128
—
—
111
A54SX16
—
81
175
—
147
—
—
—
A54SX16P
—
81
175
113
147
—
—
—
A54SX32
—
—
174
113
147
249
249
—
Package Definitions (Consult your local Actel sales representative for product availability.)
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,
PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch (1.0 mm) Ball Grid Array