MMBT2907ALT1

http://onsemi.com

6

PACKAGE DIMENSIONS

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

SOT−23 (TO−236AB)

CASE 318−08

ISSUE AK

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

D

J

K

L

A

C

B S

H

G

V

3

1

2

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102

0.1197

2.80

3.04

INCHES

B

0.0472

0.0551

1.20

1.40

C

0.0350

0.0440

0.89

1.11

D

0.0150

0.0200

0.37

0.50

G

0.0701

0.0807

1.78

2.04

H

0.0005

0.0040

0.013

0.100

J

0.0034

0.0070

0.085

0.177

K

0.0140

0.0285

0.35

0.69

L

0.0350

0.0401

0.89

1.02

S

0.0830

0.1039

2.10

2.64

V

0.0177

0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE,

NEW STANDARD 318−08.

ON Semiconductor and

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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MMBT2907ALT1/D

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