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B048F120M30 Datasheet(PDF) 1 Page - Vicor Corporation |
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B048F120M30 Datasheet(HTML) 1 Page - Vicor Corporation |
1 / 15 page vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048K120T30 Rev. 1.0 Page 1 of 16 V•I Chip Voltage Transformation Module PRELIMINARY Parameter Values Unit Notes +In to -In -1.0 to 60 Vdc +In to -In 100 Vdc For 100 ms PC to -In -0.3 to 7.0 Vdc +Out to -Out -0.5 to 30.0 Vdc Isolation voltage 2,250 Vdc Input to Output Output current 25 A Continuous Peak output current 37.5 A For 1 ms Output power 300 W Continuous Peak output power 450 W For 1 ms Case temperature 208 °C During reflow Operating junction temperature(1) -40 to 125 °C T - Grade -55 to 125 °C M - Grade Storage temperature -40 to 150 °C T - Grade -65 to 150 °C M - Grade •48V to 12 V V•I Chip Converter • 300 Watt (450 Watt for 1 ms) •High density – 1200 W/in3 • Small footprint – 280 W/in2 • Low weight – 0.5 oz (14 g) • ZVS/ZCS isolated sine amplitude converter •96% efficiency • 125°C operation • <1 µs transient response • 3.5 million hours MTBF •No output filtering required • Surface mount BGA or J-Lead packages B048K120T30 Vin = 38 - 55 V Vout = 9.5 - 13.7 V Iout = 25 A K = 1/4 Rout = 13.9 m Ω max Actual size © V•I ChipTM – BCM Bus Converter Module BCM Output Power Designator (=POUT/10) B 048 K 120 T 30 Bus Converter Module Input Voltage Designator Product Grade Temperatures (°C) Grade Storage Operating T-40 to150 -40 to125 M-65 to150 -55 to125 Configuration Options F= Onboard (Figure 20) K= Inboard (Figure 19) Output Voltage Designator (=VOUT x10) Part Numbering Note: (1) The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by a shutdown comparator. K indicates BGA configuration. For other mounting options see Part Numbering below. Product Description The V•I Chip Bus Converter Module (BCM) is a high efficiency (>96%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 9.5 V to 13.7 V secondary. The BCM may be used to power non-isolated POL converters or as an independent 9.5 – 13.7 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced—or eliminated—resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 1200 W/in3 and may be surface mounted with a profile as low as 0.16" (4 mm) over the PCB. Its V•I Chip power package is compatible with onboard or inboard surface mounting. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also available with heat sink options, assuring low junction temperatures and long life in the harshest environments. Absolute Maximum Ratings |
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