Low-Cost Integrated Offset Logic for Notebook

CPU Power Supplies

2

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PERF, SUS, DPSLP, BOM, PSM, BSM to GND ........-0.3V to +6V

Continuous Power Dissipation

8-Pin µMAX (derate 4.5mW/°C above +70°C) ...........362.0mW

Extended Operating Temperature.......................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature.........................................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

ELECTRICAL CHARACTERISTICS

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

3.0

5.5

V

BIAS

All inputs = 0

< 0.01

1

All inputs = 1.5V

10

30

µA

LOGIC AND I/Os

Logic Input High Voltage

(PERF, SUS, DPSLP),

Hysteresis = 40mV (typ)

1.2

V

0.4

Logic Input Low Voltage

(PERF, SUS, DPSLP),

Hysteresis = 40mV (typ)

0.3

V

Logic Input Current

-1

1

µA

20

50

Output On-Resistance

(BOM, BSM, PSM)

100

Ω

Output Leakage Current

(BOM, BSM, PSM)

V(pin) = 5V

< 0.01

1

µA

DYNAMICS

Falling edge, 1.5V to 0V step in 2ns

700

Propagation Delay

Rising edge, 0 to 1.5V step in 2ns

70

ns