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V048K020T080 Datasheet(PDF) 1 Page - Vicor Corporation |
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V048K020T080 Datasheet(HTML) 1 Page - Vicor Corporation |
1 / 15 page • 125°C operation •1 µs transient response •>3.5 million hours MTBF •Typical efficiency 94% at 2 V/50 A • No output filtering required • BGA or J-Lead packages Vicor Corporation Tel: 800-735-6200 V•I Chip Voltage Transformation Module V048K020T080 Rev. 1.2 Page 1 of 15 vicorpower.com PRELIMIN ARY Product Description The V048K020T080 V•I Chip Voltage Transformation Module (VTM) breaks records for speed, density and efficiency to meet the demands of advanced DSP, FPGA, ASIC, processor cores and microprocessor applications at the point of load (POL) while providing isolation from input to output. It achieves a response time of less than 1 µs and delivers up to 80 A in a volume of less than 0.25 in3 while providing low output voltages with unprecedented efficiency. It may be paralleled to deliver hundreds of amps at an output voltage settable from 1.1 to 2.3 Vdc. The VTM V048K020T080’s nominal output voltage is 2 Vdc from a 48 Vdc input factorized bus, Vf, and is controllable from 1.1 to 2.3 Vdc at no load, and from 1.1 to 2.2 Vdc at full load, over a Vf input range of 26 to 55 Vdc. It can be operated either open- or closed-loop depending on the output regulation needs of the application. Operating open-loop, the output voltage tracks its Vf input voltage with a transformation ratio, K = 1/24, and an output resistance, ROUT = 1.3 milliohm, to enable applications requiring a programmable low output voltage at high current and high efficiency. Closing the loop back to an input Pre-Regulation Module (PRM) or DC-DC converter can compensate for ROUT. The 2 V VTM achieves break-through current density of 320 A/in3 in a V•I Chip package compatible with standard pick-and-place and surface mount assembly processes. The V•I Chip BGA package supports in-board mounting with a low profile of 0.16" (4 mm) over the board. A J-lead package option supports on-board surface mounting with a profile of only 0.25" (6 mm) over the board. The VTM’s fast dynamic response and low noise eliminate the need for bulk capacitance at the load, substantially increasing the POL density while improving reliability and decreasing cost. Absolute Maximum Ratings Parameter Values Unit Notes +In to -In -1.0 to 60.0 Vdc +In to -In 100 Vdc For 100 ms PC to -In -0.3 to 7.0 Vdc TM to -In -0.3 to 7.0 Vdc VC to -In -0.3 to 19.0 Vdc +Out to -Out -0.1 to 4.0 Vdc Isolation voltage 2,250 Vdc Input to Output Operating junction temperature -40 to 125 °C See Note Output current 80 A Continuous Peak output current 120 A For 1 ms Case temperature during reflow 208 °C Storage temperature -40 to 150 °C Output power 174 W Continuous Peak output power 261 W For 1 ms V•I ChipTM – VTM Voltage Transformation Module •48V to 2 V V•I Chip Converter • 80 A (120 A for 1 ms) •High density – 320 A/in3 •Small footprint – 75 A/in2 • Low weight – 0.5 oz (14 g) • Pick & Place / SMD V048K020T080 Vf = 26 - 55 V VOUT = 1.1 - 2.3 V IOUT = 80 A K = 1/24 ROUT = 1.5 m Ω max Actual size © VTM Note: The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator. K indicates BGA configuration. For other mounting options see Part Numbering below. Output Current Designator (=IOUT) V 048 K 020 T 080 Voltage Transformation Module Input Voltage Designator Product Grade Temperatures (°C) Grade Storage Operating T-40 to150 -40 to125 Configuration Options F= On-board (Fig.15) K= In-board (Fig.14) Output Voltage Designator (=VOUT x10) Part Numbering |
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