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V•I Chip Voltage Transformation Module

Rev. 1.6

Page 6 of 20

PRELIMINARY

V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS

Specifications, continued

Symbol

Parameter

Min

Typ

Max

Unit

Note

Over temperature shutdown

125

130

135

°C

Junction temperature

Thermal capacity

0.61

Ws/°C

Junction-to-case thermal impedance

1.1

°C/W

Junction-to-BGA thermal impedance

2.1

°C/W

6.5

°C/W

5.0

°C/W

THERMAL

Notes

1. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.

2. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.

Test

Standard

Environment

High Temperature Operational Life (HTOL)

JESD22-A-108-B

125°C, Vmax, 1,008 hrs

Temperature cycling

JESD22-A-104B

-55°C to 125°C, 1,000 cycles

High temperature storage

JESD22-A-103A

150°C, 1,000 hrs

Moisture resistance

JESD22-A113-B

Moisture sensitivity Level 4

Temperature Humidity Bias Testing (THB)

EIA/JESD22-A-101-B

85°C, 85% RH, Vmax, 1,008 hrs

Pressure cooker testing (Autoclave)

JESD22-A-102-C

121°C, 100% RH, 15 PSIG, 96 hrs

Highly Accelerated Stress Testing (HAST)

JESD22-A-110B

130°C, 85% RH, Vmax, 96 hrs

Solvent resistance/marking permanency

JESD22-B-107-A

Solvents A, B & C as defined

Mechanical vibration

JESD22-B-103-A

20g peak, 20-2,000 Hz, test in X, Y & Z directions

Mechanical shock

JESD22-B-104-A

1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions

Electro static discharge testing – human body model

EIA/JESD22-A114-A

Meets or exceeds 2,000 Volts

Electro static discharge testing – machine model

EIA/JESD22-A115-A

Meets or exceeds 200 Volts

Highly Accelerated Life Testing (HALT)

Per Vicor Internal

Operation limits verified, destruct margin determined

Test Specification

Dynamic cycling

Per Vicor internal

Constant line, 0-100% load,

-20°C to 125°C

test specification

Test

Standard

Environment

BGA Daisy-Chain thermal cycling

IPC-SM-785

TC3, -40 to 125°C at <10 °C/min,

IPC-9701

10 min dwell time

Ball shear

IPC-9701

No failure through intermetallic

IPC J-STD-029

Bend test

IPC J-STD-029

Deflection through 4 mm

V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION