MUN5211T1 Series

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10

PACKAGE DIMENSIONS

SC−70/SOT−323

CASE 419−04

ISSUE L

STYLE 3:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

C

N

A

L

D

G

S

B

H

J

K

3

12

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.071

0.087

1.80

2.20

B

0.045

0.053

1.15

1.35

C

0.032

0.040

0.80

1.00

D

0.012

0.016

0.30

0.40

G

0.047

0.055

1.20

1.40

H

0.000

0.004

0.00

0.10

J

0.004

0.010

0.10

0.25

K

0.017 REF

0.425 REF

L

0.026 BSC

0.650 BSC

N

0.028 REF

0.700 REF

S

0.079

0.095

2.00

2.40

0.05 (0.002)

1.9

0.075

0.65

0.025

0.65

0.025

0.9

0.035

0.7

0.028

mm

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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MUN5211T1/D

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